US 2016/0052167 A1

Gypsum board manufacturing method and manufacturing device

(22) 24.03.2014

(43) 25.02.2016

(57) As a lower forming plate 8, a forming plate having: a lower plate main body 10 constituted from an electrically conduc­tive material; and a lower embedded electrode 12 embedded in the lower plate main body 10, the lower embedded elec­trode 12 being electrically insulated from the lower plate main body 10 by an insulator 14 and being embedded so as for a portion thereof to be exposed on the surface of the lower plate main body 10 making contact with a lower lining paper sheet 16 is used.

(71) Yoshino Gypsum Co., Ltd., Tokyo (JP)

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